Adopting Chip on Board chip-level packaging technology multiple LED Chip Integrated and packaged on the substrate to form a high-pixel-density display unit.
Core principle:
1. Molding encapsulation: The modified silicon is cured as a whole to achieve all-round protection for the chip
2. Full flip-chip technology: The chip is directly welded to the substrate to elim inate the defects of the gold wire process
Meet the needs of different customers and different solutions.
| Pixel pitch | P0.7 | P0.93 | P1.25 | P1.56 |
| Single-box display resolution | 857*482 | 640*360 | 480*270 | 384*216 |
| COB Lamp panel size (mm) | 150*168.75mm | |||
| COB Lamp panel resolution | 214*241 | 160*180 | 120*135 | 96*108 |
| COB Lamp panel surface technology | Matte finish | |||
| COB Total weight of the lamp panel | ≈1.2Kg | |||
| Dimensions of the finished cabinet (mm) | 600*337.5*39.5mm | |||
| Total weight of the finished cabinet | ≈4.0/Kg | |||
| Pixel density (per/square meter) | 2039872 | 1137777 | 640000 | 409600 |
| Circuit scheme | Common cathode | Common cathode | Common cathode /Common anode | Common cathode /Common anode |
| Falsh Correction storage | Support | |||
| White balance brightness (nit) | Typ600 | |||
| Refresh rate (Hz) | 3840 & 7680 (Customization required) | |||
| Frame refresh rate (Hz) | 50/60 & 120 (Customization required) | |||
| Contrast ratio | 20000:1 | |||
| Color temperature (K) | 3000K-10000K (Adjustable) | |||
| Viewing angle | Horizontal and vertical ≤170° | |||
| Single cabinet power consumption at 600 nit | ≤55W | ≤55W | ≤48W | ≤53W |
| Power consumption per square meter at 600 nit | ≤275W/m² | ≤275W/m² | ≤240W | ≤265W |
| Maintenance method | Full front maintenance /Partial rear maintenance available | |||
| Backup (Optional) | Dual cards, dual batteries, and dual power supplies | |||
| Control system | Nova & Colorlight | |||
| Certification | Compliance3C, EMC CLASS-A, CE, ROHS, Energy-saving | |||
1. Flexible space, worry-free maintenance
Removable back cover, supporting customer customization
-Core advantage: Supports full front maintenance and partia! rear maintenance without disassembly Remove the full screen
-Applicable scenarios: Narrow spaces/Embeddedinstallation/Quick response maintenance
2. Double protection for stable online operation
3. Lighter·Smaller·More flexible
Data comparison: Compared with the traditionalSMDThe box weight is reduced30%and the thickness is reduced40% -Application advantages: Save transportation costs and improve installation efficiency
4. Anti - fooling circuit design for safe installation
The pin definition of the lamp board connector is a foolproof design. 100% Eliminate the risk of board burning caused by reverse installation, even for beginners. Zero installation errors.
